Abstract Groundbreaking advancements have driven significant industries to adopt and take advantage of the key technologies in order to thrive in these adjustments coming from the Fourth Industrial Revolution (FIRe). However, with the threat of the Coronavirus disease 2019 (COVID-19) …
Abstract Ball grid array (BGA) is one of the most innovative semiconductor packaging technologies which is capable of high input-output capacities while addressing handling and coplanarity compared with other packages. However, the BGA package is subjected to thermo-mechanical load which …
Abstract Warpage due to thermal stresses in IC packaging is a current challenge for the semiconductor manufacturing industry. This study uses FEM coupled with a direct optimization to reduce warpage in an AMB IC package. ANSYS Static Structural module was …
Abstract With the advancement of technology, semiconductor devices become more complex to satisfy the need for more features while reducing the size. For a component with varying material parts such as the semiconductor package, it is prone to warpage because …
In time for its 88th General Membership Assembly, National Research Council of the Philippines (NRCP), the country’s premier agency for basic and fundamental research and the largest collegial body, has named its member-awardees and member emeriti as the recipients …
