Abstract The warpage induced during the manufacturing process affects the yield, quality, and reliability of the semiconductor packages. Unavoidable and severe stress and deformation are observed because of incompatible of thermal expansion coefficient (CTE) of the materials such as the …
Abstract Semiconductors and electronics have been found to have an increasing use in automobile design. One key component of an automobile is the power module, which is a high voltage component that finds itself in extreme operating conditions. Due to …
Abstract The automotive industry places electronic components in vastly different conditions compared to that for residential purposes. Thus, there are certain components that have found an essential use in this industry. One such component is the press fit pin. The …
Abstract Solderless press-fit contacts in power module packages are now gaining more attention in the automotive industry especially in hybrid electric vehicles because of the Restriction of Hazardous Substances (RoHS) directive to eliminate lead-based connections. The production of press-fit assembly …
Abstract Proper design of semiconductors is the most essential step in ensuring electronic product reliability during manufacturing. The adoption of design optimization approach enhances the performance and reliability of the semiconductor package, hence, minimizes product failure. Semiconductor reliability especially in …
Abstract Groundbreaking advancements have driven significant industries to adopt and take advantage of the key technologies in order to thrive in these adjustments coming from the Fourth Industrial Revolution (FIRe). However, with the threat of the Coronavirus disease 2019 (COVID-19) …
Abstract Ball grid array (BGA) is one of the most innovative semiconductor packaging technologies which is capable of high input-output capacities while addressing handling and coplanarity compared with other packages. However, the BGA package is subjected to thermo-mechanical load which …
Abstract Warpage due to thermal stresses in IC packaging is a current challenge for the semiconductor manufacturing industry. This study uses FEM coupled with a direct optimization to reduce warpage in an AMB IC package. ANSYS Static Structural module was …
Abstract With the advancement of technology, semiconductor devices become more complex to satisfy the need for more features while reducing the size. For a component with varying material parts such as the semiconductor package, it is prone to warpage because …