Contact

[email protected]

Mr. Niño Rigo Emil G. Lim

Teaching Associate

Educational Background

PhD in Mechanical Engineering (Candidate),
De La Salle University, Manila, Philippines

Master of Science in Mechanical Engineering,
De La Salle University, Manila, Philippines

Bachelor of Science in Mechanical Engineering,
De La Salle University, Manila, Philippines

Niño Rigo Emil Lim is a Full-time Faculty at the Department of Mechanical Engineering, De La Salle University. He is a member of the Thermomechanical Analysis Laboratory at the De La Salle University – Laguna campus. His research includes finite element analysis, semiconductor packaging design, computational fluid dynamics, optimization, and metamaterial design.

Research Interest

  • Finite Element Analysis
  • Metamaterials
  • Energy
  • Computational Fluid Dynamics

Selected Publications

  • Lim, N. R. E. G., Ubando, A. T., Gonzaga, J. A., & Dimagiba, R. R. N. (2020). Finite element analysis on the factors affecting die crack propagation in BGA under thermo-mechanical loading. Engineering Failure Analysis, 116, 104717.
  • Lim, N. R. E., Arriola, E., Moran, R. L., Mercado, J. P., Dimagiba, R., Gonzaga, J., & Ubando, A. (2019, November). Material properties sensitivity analysis based on thermomechanical analysis on warpage for ball grid array semiconductor packaging. In 2019 IEEE 11th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management (HNICEM) (pp. 1-5). IEEE.
  • Moran, R. L., Arriola, E., Lim, N. R. E., Mercado, J. P., Dimagiba, R., Gonzaga, J., & Ubando, A. (2019, November). Reduction of IC package warpage through finite element analysis and direct optimization. In 2019 IEEE 11th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management (HNICEM) (pp. 1-6). IEEE.
  • Lim, N. R. E. G., Gonzaga, J., & Ubando, A. (2022, December). Development and Verification of Effective Layer Function for Simulating Flip-Chip Packages. In 2022 IEEE 14th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management (HNICEM) (pp. 1-5). IEEE.
  • Arriola, E., Lim, N. R. E., Moran, R. L., Mercado, J. P., Dimagiba, R., Gonzaga, J., & Ubando, A. (2019, November). Evaluation of the effects of introducing channels to composite materials to reduce warpage on semiconductor packages due to coefficient of thermal expansion mismatch. In 2019 IEEE 11th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management (HNICEM) (pp. 1-5). IEEE.

GET IN TOUCH WITH US

St. La Salle Hall, De La Salle University
2401 Taft Avenue, Malate 1004, Manila, Philippines

Gokongwei College of Engineering (Andrew Bldg. 9th flr)
Trunkline: +632 85244611 local 229
Direct Line: +632 85244611
Mechanical Engineering Department (Andrew Bldg. 8th flr)
Phone: (632) 524-4611 loc. 299
Email: [email protected]