CRADLE: Development of a Design Guideline Using Finite Element Analysis (FEA) for Semiconductor Packages

The semiconductor and electronics industry captures almost half of the Philippines’ total export share in 2016 at US$ 28.8 billion (The Philippine Star, 2017). As the demand for electronic devices increases, the growth for the development, design, and manufacturing of semiconductor packaging devices is projected to grow. The demand for thinner and wider electronic devices drives the development of thinner and wider semiconductor packaging devices.

Read more here